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Important factors in solder paste printing
Solder paste volume and solder print alignment are critical to the solder printing process. Depending on the situation, having all the solder paste you need in the wrong location means less than having less solder paste on the pad. A small amount of misalignment can be tolerated because the solder will pull back onto the solderable surface. Excessive misalignment can cause problems. Not enough solder paste can cause problems to appear on the pad or slightly off the pad.
2021-06-28 14:10:42Shenzhen huanchengxin Precision Manufacture Co.,Ltd.2
The key factors controlling solder paste volume, stencil aperture or machine settings depend on the specific situation. If the machine settings are significantly outside the process window (which is true for every solder paste), then the aperture size will not help much. The same can be said for the stencil aperture, if the standard design rules for wall area to open area are broken, then there is little machine setting that can help.
Huancheng printing machine has double-lens automatic registration function. Nice printing effect
The browser own share function is also very useful~
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Floor 3, 4, Building 2, Building A2, Huimingsheng Industrial Park, Heping Community, Fuhai Street, Bao'an District, Shenzhen (Factory Building 2, Huimingsheng Industrial Park)
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